Invention Grant
- Patent Title: Device and method for processing of wafers
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Application No.: US13948478Application Date: 2013-07-23
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Publication No.: US09771223B2Publication Date: 2017-09-26
- Inventor: Friedrich Paul Lindner , Peter Oliver Hangweier
- Applicant: EV Group GmbH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV Group GmbH
- Current Assignee: EV Group GmbH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- Priority: DE102010048043 20101015
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B65G47/00 ; H01L21/67
Abstract:
The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
Public/Granted literature
- US20130309046A1 DEVICE AND METHOD FOR PROCESSING OF WAFERS Public/Granted day:2013-11-21
Information query
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