Invention Grant
- Patent Title: Sintering apparatus, method of manufacturing sintered compact, and target material
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Application No.: US14294734Application Date: 2014-06-03
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Publication No.: US09771305B2Publication Date: 2017-09-26
- Inventor: Kiwamu Adachi
- Applicant: Sony Corporation
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Dentons US LLP
- Priority: JP2013-127684 20130618
- Main IPC: B29C43/10
- IPC: B29C43/10 ; C04B35/645 ; B28B3/02 ; B28B7/44 ; B30B11/02 ; B30B15/34 ; B30B15/00

Abstract:
A sintering apparatus includes: a non-transportable section mounted in the atmosphere; a transportable section that has a mold capable of accommodating a material to be processed and is loaded detachably with respect to the non-transportable section; and a covering member that envelops the transportable section loaded on the non-transportable section in an almost hermetically sealed state and allows the transportable section to be separated from the non-transportable section with the transportable section enveloped in the almost hermetically sealed state.
Public/Granted literature
- US20140367251A1 SINTERING APPARATUS, METHOD OF MANUFACTURING SINTERED COMPACT, AND TARGET MATERIAL Public/Granted day:2014-12-18
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