Invention Grant
- Patent Title: Adhesive having structural integrity and insulative properties
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Application No.: US14092110Application Date: 2013-11-27
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Publication No.: US09771499B2Publication Date: 2017-09-26
- Inventor: Tianjian Huang , Robert Sandilla , Daniel Waski , Kristina Thompson , John Meccia
- Applicant: Henkel IP & Holding GmbH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Main IPC: C09J11/08
- IPC: C09J11/08 ; B32B7/12 ; B32B3/28 ; B32B1/02 ; D21H19/54 ; D21H27/10 ; D21H27/36 ; D21H19/10 ; D21H19/24 ; D21H21/52 ; D21H21/54 ; C08K9/10 ; C08L3/02
Abstract:
An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.
Public/Granted literature
- US20140087109A1 ADHESIVE HAVING STRUCTURAL INTEGRITY AND INSULATIVE PROPERTIES Public/Granted day:2014-03-27
Information query
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