Invention Grant
- Patent Title: Sealant composition for electronic device
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Application No.: US15014231Application Date: 2016-02-03
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Publication No.: US09771500B2Publication Date: 2017-09-26
- Inventor: Yusuke Horiguchi , Kenichiro Sato , Mieko Sano
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent James J. Cummings
- Main IPC: C09J135/02
- IPC: C09J135/02 ; H01L21/56 ; C09J11/06 ; H01L23/29 ; C08F222/40 ; H01L23/00 ; C09J133/24 ; H01L23/31
Abstract:
The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.
Public/Granted literature
- US20160177148A1 SEALANT COMPOSITION FOR ELECTRONIC DEVICE Public/Granted day:2016-06-23
Information query
IPC分类:
