Invention Grant
- Patent Title: Substrate carrier unit for a film deposition apparatus
-
Application No.: US14704422Application Date: 2015-05-05
-
Publication No.: US09771649B2Publication Date: 2017-09-26
- Inventor: Chung-Yu Yeh , Huei-Chia Su , Cheng-Peng Yeh , Tsung-Wei Chang , Yi-Yuan Huang , Wan-Yu Huang , Mu-Sen Lu
- Applicant: Linco Technology Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Linco Technology Co., Ltd.
- Current Assignee: Linco Technology Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Trop Pruner & Hu, P.C.
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C23C14/50 ; H01L21/673 ; H01L21/677 ; H01J37/32 ; C23C14/54 ; C23C14/56 ; H01J37/34

Abstract:
A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.
Public/Granted literature
- US20160326637A1 Substrate Carrier Unit for a Film Deposition Apparatus Public/Granted day:2016-11-10
Information query
IPC分类: