Invention Grant
- Patent Title: System for forming floor underlayment
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Application No.: US15439346Application Date: 2017-02-22
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Publication No.: US09771727B2Publication Date: 2017-09-26
- Inventor: Akiva Pinto , Chad A. Collison
- Applicant: Akiva Pinto , Chad A. Collison
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: E04F15/18
- IPC: E04F15/18 ; B32B37/14 ; B32B5/02 ; B32B37/12 ; E04F15/20 ; E04F15/04

Abstract:
A process for making a fibrous panel member and a flooring structure is disclosed. The flooring structure has a subfloor, a surface layer, and an insulative pad disposed between the subfloor and the surface layer. The insulative pad has an MDI binder and reinforcement fibers distributed uniformly and randomly within a first plane. The process includes mixing a porous fiber material with a MDI adhesive. The fiber batt is compressed between a pair of porous belts. Steam and heat are applied to the compressed batt to form a bound flexible batting material.
Public/Granted literature
- US20170159301A1 SYSTEM FOR FORMING FLOOR UNDERLAYMENT Public/Granted day:2017-06-08
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