Invention Grant
- Patent Title: Physical quantity measuring sensor including an O-ring between a cylindrical portion and a cylindrical projection
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Application No.: US14560818Application Date: 2014-12-04
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Publication No.: US09772242B2Publication Date: 2017-09-26
- Inventor: Hironori Kobayashi , Shuji Tohyama , Yusuke Abe , Haruhiko Sekiya
- Applicant: NAGANO KEIKI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NAGANO KEIKI CO., LTD.
- Current Assignee: NAGANO KEIKI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2013-253109 20131206; JP2013-253110 20131206
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L19/00 ; G01L19/14
Abstract:
A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.
Public/Granted literature
- US20150160085A1 PHYSICAL QUANTITY MEASURING SENSOR AND SENSOR MODULE Public/Granted day:2015-06-11
Information query
