Invention Grant
- Patent Title: Prober having linkage portion, method for manufacturing the prober and method of testing circuit boards using the prober
-
Application No.: US14801114Application Date: 2015-07-16
-
Publication No.: US09772352B2Publication Date: 2017-09-26
- Inventor: Masashi Kobayashi , Takahiro Ogawara
- Applicant: HIOKI DENKI KABUSHIKI KAISHA
- Applicant Address: JP Nagano
- Assignee: HIOKI DENKI KABUSHIKI KAISHA
- Current Assignee: HIOKI DENKI KABUSHIKI KAISHA
- Current Assignee Address: JP Nagano
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-153547 20140729; JP2015-048627 20150311; JP2015-105335 20150525
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R3/00 ; G01R1/073

Abstract:
A probe unit includes a probe pin and a support unit supporting the probe pin. The support unit includes first and second arms disposed at a distance along a direction in which the probe pin probes a probed object; a holding unit holding base ends of the arms; and a linking unit attached to the probe pin and linking front ends of the arms. The support unit constructs a four-bar linkage that permits linear or approximately linear movement of the probe pin in an opposite direction to the probing direction. The first and second arms have through-holes at positions slightly closer to the front ends than the base ends and positions slightly closer to the base ends than the front ends, center parts between the through-holes function as bars in the four-bar linkage, and formation positions of the through-holes function as joints in the four-bar linkage.
Public/Granted literature
- US20160033552A1 PROBE UNIT, METHOD OF MANUFACTURING PROBE UNIT, AND TESTING METHOD Public/Granted day:2016-02-04
Information query