Invention Grant
- Patent Title: Semiconductor bump-bonded X-ray imaging device
-
Application No.: US15054261Application Date: 2016-02-26
-
Publication No.: US09772410B2Publication Date: 2017-09-26
- Inventor: Konstantinos Spartiotis , Henri Tapio Nykanen , Limin Lin , Tuomas Heikki Elmeri Lahtinen , Pasi Juhani Laukka
- Applicant: OY AJAT LTD.
- Applicant Address: FI Espoo
- Assignee: OY AJAT LTD.
- Current Assignee: OY AJAT LTD.
- Current Assignee Address: FI Espoo
- Agency: Young & Thompson
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G01T1/24 ; H01L31/028
Abstract:
A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
Public/Granted literature
- US20160181306A1 SEMICONDUCTOR BUMP-BONDED X-RAY IMAGING DEVICE Public/Granted day:2016-06-23
Information query
IPC分类:
