Invention Grant
- Patent Title: Wireless bus for intra-chip and inter-chip communication, including adaptive link and route embodiments
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Application No.: US12877729Application Date: 2010-09-08
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Publication No.: US09772880B2Publication Date: 2017-09-26
- Inventor: Ahmadreza (Reza) Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
- Applicant: Ahmadreza (Reza) Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
- Applicant Address: SG Singapore
- Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
- Current Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H04W80/04
- IPC: H04W80/04 ; G06F9/50 ; H04B7/10 ; H04B5/00 ; H04W4/00 ; H04W84/18 ; H04B7/26

Abstract:
Embodiments of the present invention are directed to a wireless bus for intra-chip and inter-chip communication having adaptable links and routes among wireless-enabled components (WECs) of the wireless bus. Links and routes may be adapted according to one or more of, among other factors, the relative position of WECs, available capabilities (e.g., communication capabilities) at WECs, availability of resources at WECs, and the physical environment.
Public/Granted literature
- US20110182218A1 Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Adaptive Link and Route Embodiments Public/Granted day:2011-07-28
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