Invention Grant
- Patent Title: Folding type capacitor comprising through hole
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Application No.: US14825538Application Date: 2015-08-13
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Publication No.: US09773617B2Publication Date: 2017-09-26
- Inventor: Bum Mo Ahn , Seung Ho Park
- Applicant: POINT ENGINEERING CO., LTD.
- Applicant Address: KR Asan-si
- Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee Address: KR Asan-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0106748 20140818
- Main IPC: H01G4/26
- IPC: H01G4/26 ; H01G4/005 ; H01G4/30 ; H01G4/38 ; H01G4/10

Abstract:
A folding type capacitor includes a metal substrate wherein a through hole penetrates an inside thereof; at least one dielectric layer formed on a surface of the metal substrate and an inner peripheral surface of the through hole; and an electrode layer formed on the at least one dielectric layer, wherein the metal substrate has bending portions whose surfaces are facing each other. Thus, manufacturing process is more simplified since Al2O3 insulation layers are formed by anodizing the aluminum layer without forming the extra dielectric layers after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-stacked capacitor having a high capacitance and a high reliability can be provided by stacking capacitors including a plurality of aluminum oxide layers using a more simplified process.
Public/Granted literature
- US20160049251A1 FOLDING TYPE CAPACITOR COMPRISING THROUGH HOLE Public/Granted day:2016-02-18
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