Invention Grant
- Patent Title: Fuse element assemblies
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Application No.: US14847235Application Date: 2015-09-08
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Publication No.: US09773632B2Publication Date: 2017-09-26
- Inventor: Sumio Ogawa
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01H85/05
- IPC: H01H85/05 ; H01H85/143

Abstract:
Some embodiments include a fuse element assembly having a first portion configured to rupture as materials of the first portion flow to a second portion through electromigration. The assembly has a second portion configured to accumulate the materials that have flowed from the first portion. The assembly also has a control element configured to divide the flow of materials into at least two paths along the second portion. The first portion may be a fuse-link and the second portion may be a cathode coupled to the fuse-link through a narrow neck region. The control element may be, for example, a slit, a hole, a conductive contact, etc.
Public/Granted literature
- US20170069454A1 Fuse Element Assemblies Public/Granted day:2017-03-09
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