Invention Grant
- Patent Title: Method of forming micropatterns
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Application No.: US15016309Application Date: 2016-02-05
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Publication No.: US09773672B2Publication Date: 2017-09-26
- Inventor: Su-min Kim , Hyun-woo Kim , Hyo-jin Yun , Kyoung-seon Kim , Hai-sub Na , Su-min Park , So-ra Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0019667 20150209
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L21/033 ; H01L21/311 ; H01L21/3105 ; H01L21/3213 ; H01L21/28 ; H01L21/02
Abstract:
A method of manufacturing a semiconductor device, including forming an etching target film on a substrate; forming an anti-reflection film on the etching target film; forming a photoresist film on the anti-reflection film; exposing the photoresist film; performing heat treatment on the anti-reflection film and the photoresist film to form a covalent bond between the anti-reflection film and the photoresist film; and developing the photoresist film.
Public/Granted literature
- US20160233083A1 METHOD OF FORMING MICROPATTERNS Public/Granted day:2016-08-11
Information query
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