Invention Grant
- Patent Title: Method of manufacturing an ultra low dielectric layer
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Application No.: US14871305Application Date: 2015-09-30
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Publication No.: US09773698B2Publication Date: 2017-09-26
- Inventor: Robert L. Bruce , Geraud J. Dubois , Gregory Fritz , Teddie P. Magbitang , Hiroyuki Miyazoe , Willi Volksen
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/316 ; H01L21/768 ; H01L21/3105 ; H01L23/528 ; H01L23/532 ; C09D183/04 ; H01L23/52

Abstract:
An article may include a structure including a patterned metal on a surface of a substrate, the patterned metal including metal features separated by gaps of an average dimension of less than about 1000 nm. A porous low dielectric constant material having a dielectric value of less than about 2.7 substantially occupies all gaps. An interface between the metal features and the porous low dielectric constant material may include less than about 0.1% by volume of voids. A method may include depositing a filling material including a silicon-based resin having a molecular weight of less than about 30,000 Da and a porogen having a molecular weight greater than about 400 Da onto a structure comprising a patterned metal. The deposited filling material may be subjected to a first thermal treatment to substantially fill all gaps, and subjected to a second thermal treatment and a UV radiation treatment.
Public/Granted literature
- US20170092534A1 ULTRA LOW DIELECTRIC LAYER Public/Granted day:2017-03-30
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