Invention Grant
- Patent Title: Via and trench filling using injection molded soldering
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Application No.: US15214935Application Date: 2016-07-20
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Publication No.: US09773751B1Publication Date: 2017-09-26
- Inventor: John U. Knickerbocker , Shriya Kumar , Jae-Woong Nah
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Louis J. Percello
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498
Abstract:
A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.
Information query
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