One or more example embodiments of miniaturized electric devices are disclosed. In some example embodiments, the electric device includes a first thin substrate layer and a second thin substrate layer positioned above the first thin substrate layer. The electric device further includes one or more components electrically coupled to the first thin substrate layer. An overmold compound is deposited covering the one or more components between the first thin substrate and the second thin substrate. The electric device further includes one or more through mold vias that electrically and communicatively connect the first thin substrate layer and the second thin substrate layer.