Invention Grant
- Patent Title: Forming metal-insulator-metal capacitor
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Application No.: US15401530Application Date: 2017-01-09
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Publication No.: US09773783B2Publication Date: 2017-09-26
- Inventor: Veeraraghavan S. Basker , Kangguo Cheng
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Steven Meyers
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L49/02 ; H01L27/108 ; H01L29/78

Abstract:
A semiconductor device comprises a transistor device arranged on a substrate. The transistor device comprises a first metal gate stack arranged over a channel region, a source/drain region arranged adjacent to the metal gate stack, the source/drain region located on a fin, and a capacitor device arranged on the substrate. The capacitor device comprises a second metal gate stack arranged on the substrate, a spacer arranged along a sidewall of the second metal gate stack, and a first conductive contact arranged on the substrate adjacent to the spacer such that the spacer is disposed between the first conductive contact and the second metal gate stack.
Public/Granted literature
- US20170170168A1 FORMING METAL-INSULATOR-METAL CAPACITOR Public/Granted day:2017-06-15
Information query
IPC分类: