Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15150249Application Date: 2016-05-09
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Publication No.: US09773798B2Publication Date: 2017-09-26
- Inventor: Kwang Hee Han
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2015-0182898 20151221
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L27/11565 ; H01L27/11568 ; H01L27/11582 ; H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L21/768

Abstract:
A semiconductor device includes channel layers arranged in a first direction and a second direction intersecting the first direction; stacked insulating layers surrounding sidewalls of the channel layers; stacked gate electrodes interposed between the insulating layers, the gate electrodes respectively surrounding the channel layers; and stacked gate lines interposed between the insulating layers, the gate lines electrically connecting the gate electrodes to each other.
Public/Granted literature
- US20170179144A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-06-22
Information query
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