Invention Grant
- Patent Title: Capacitor and method for fabricating the same
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Application No.: US15257930Application Date: 2016-09-07
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Publication No.: US09773860B1Publication Date: 2017-09-26
- Inventor: Yu-Tsung Lai , Ching-Li Yang , Yu-Cheng Tung , Shih-Che Huang , Chih-Sheng Chang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW105125109A 20160808
- Main IPC: H01L49/02
- IPC: H01L49/02

Abstract:
A method for fabricating a capacitor is disclosed. First, a substrate is provided, a bottom electrode and a capacitor dielectric layer are formed on the substrate, a conductive layer is formed on the capacitor dielectric layer, a patterned hard mask is formed on the conductive layer, a patterned hard mask is used to remove part of the conductive layer to form a top electrode, the patterned hard mask is removed, and a protective layer is formed on a top surface and sidewalls of top electrode. Preferably, the protective layer includes metal oxides.
Information query
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