Invention Grant
- Patent Title: Isolation structure of fin field effect transistor
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Application No.: US15017224Application Date: 2016-02-05
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Publication No.: US09773892B2Publication Date: 2017-09-26
- Inventor: Kuo-Cheng Ching , Guan-Lin Chen , Chao-Hsiung Wang , Chi-Wen Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L21/762 ; H01L29/10 ; H01L21/225 ; H01L21/306 ; H01L21/3115

Abstract:
A representative fin field effect transistor (FinFET) includes a substrate having a major surface; a fin structure protruding from the major surface having a lower portion comprising a first semiconductor material having a first lattice constant; an upper portion comprising the first semiconductor material. A bottom portion of the upper portion comprises a dopant with a first peak concentration. A middle portion is disposed between the lower portion and upper portion, where the middle portion comprises a second semiconductor material having a second lattice constant different from the first lattice constant. An isolation structure surrounds the fin structure, where a portion of the isolation structure adjacent to the bottom portion of the upper portion comprises the dopant with a second peak concentration equal to or greater than the first peak concentration.
Public/Granted literature
- US20160172470A1 Isolation Structure of Fin Field Effect Transistor Public/Granted day:2016-06-16
Information query
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