Invention Grant
- Patent Title: Optical sensor device
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Application No.: US15117050Application Date: 2015-01-27
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Publication No.: US09773926B2Publication Date: 2017-09-26
- Inventor: Koji Tsukagoshi , Noriyoshi Higashi
- Applicant: SII SEMICONDUCTOR CORPORATION
- Applicant Address: JP
- Assignee: SII Semiconductor Corporation
- Current Assignee: SII Semiconductor Corporation
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2014-028570 20140218; JP2014-262223 20141225
- International Application: PCT/JP2015/052100 WO 20150127
- International Announcement: WO2015/125564 WO 20150827
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L31/0203 ; C03C3/21 ; H01L31/02 ; H01L31/0216

Abstract:
An optical sensor device includes a resin sealing portion for sealing an optical sensor element fixed to an element-mounting portion. The resin sealing portion is constituted of a resin having mixed and dispersed therein a glass filler obtained by pulverizing a phosphate-based glass which has spectral luminous efficacy properties by composition adjustment and high heat resistance and weatherability. The optical sensor device is highly reliable and capable of accommodating size and thickness reductions in packages and has stable and hardly changeable spectral luminous efficacy properties.
Public/Granted literature
- US20160351730A1 OPTICAL SENSOR DEVICE Public/Granted day:2016-12-01
Information query
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