Invention Grant
- Patent Title: Integrated circuit with reflective material in trenches and related methods
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Application No.: US15240610Application Date: 2016-08-18
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Publication No.: US09773930B2Publication Date: 2017-09-26
- Inventor: Lorenzo Motta , Claudio Alfonso Giacomo Savoia
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Slater Matsil, LLP
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L27/146 ; H01L27/144 ; H01L31/02 ; H01L31/0216 ; H01L31/0224 ; H01L31/107 ; H01L31/18
Abstract:
An IC may include a substrate and a layer, and an array of GMAPDs in the layer. The layer may have trenches extending between adjacent GMAPDs. The IC may include an optically reflective material within the trenches. The optically reflective material may also be electrically conductive. For example, the optically reflective material may comprise a metal. Also, the trenches may be arranged in a honeycomb pattern.
Public/Granted literature
- US20160359057A1 INTEGRATED CIRCUIT WITH REFLECTIVE MATERIAL IN TRENCHES AND RELATED METHODS Public/Granted day:2016-12-08
Information query
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