Invention Grant
- Patent Title: Epitaxial wafer and method for manufacturing same
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Application No.: US15028225Application Date: 2014-08-18
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Publication No.: US09773932B2Publication Date: 2017-09-26
- Inventor: Kei Fujii , Koji Nishizuka , Takashi Kyono , Kaoru Shibata , Katsushi Akita
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Miguel A. Lopez
- Priority: JP2013-219597 20131022
- International Application: PCT/JP2014/071560 WO 20140818
- International Announcement: WO2015/059988 WO 20150430
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/00 ; H01L31/0352 ; H01L21/02 ; H01L31/0304 ; H01L31/18

Abstract:
An epitaxial wafer which allows manufacture of a photodiode having suppressed dark current and ensured sensitivity, and a method for manufacturing the epitaxial wafer, are provided. The epitaxial wafer of the present invention includes: a III-V semiconductor substrate; and a multiple quantum well structure disposed on the substrate, and including a plurality of pairs of a first layer and a second layer. The total concentration of elements contained as impurities in the multiple quantum well structure is less than or equal to 5×1015 cm−3.
Public/Granted literature
- US20160247951A1 EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME Public/Granted day:2016-08-25
Information query
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