Invention Grant
- Patent Title: High-frequency signal line and manufacturing method thereof
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Application No.: US14537059Application Date: 2014-11-10
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Publication No.: US09774070B2Publication Date: 2017-09-26
- Inventor: Nobuo Ikemoto , Yuki Wakabayashi , Shigeru Tago
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-240091 20121031
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P11/00 ; H05K1/02 ; H05K1/11 ; H05K1/14 ; H05K3/36 ; H01R12/62 ; H05K3/00 ; H05K3/46 ; H01R103/00 ; H01R24/50

Abstract:
In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.
Public/Granted literature
- US20150054601A1 HIGH-FREQUENCY SIGNAL LINE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-02-26
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