Invention Grant
- Patent Title: Housing, handheld device, and manufacturing method of housing
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Application No.: US14154199Application Date: 2014-01-14
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Publication No.: US09774072B2Publication Date: 2017-09-26
- Inventor: Cheng-Han Chung , Chih-Kuang Wang , Yen-Liang Kuo
- Applicant: HTC Corporation
- Applicant Address: TW Taoyuan
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Priority: TW98134312A 20091009
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/40 ; H01Q1/44

Abstract:
A housing, a handheld device and a manufacturing method of a housing are provided. The housing includes a body, a metal antenna layer, and a conductive element. The body includes a through hole and an outer surface and an inner surface opposite to the outer surface. The metal antenna layer is disposed on the outer surface and covers the through hole, wherein an edge of the metal antenna layer is connected to the outer surface seamlessly, and a surface of the metal antenna layer is at least partially exposed by the body. The conductive element is disposed in the through hole and directly contacts the metal antenna layer to transmit signals received by the metal antenna layer.
Public/Granted literature
- US20140191910A1 HOUSING, HANDHELD DEVICE, AND MANUFACTURING METHOD OF HOUSING Public/Granted day:2014-07-10
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