Each channel of a high speed multi-channel transmitter or receiver IC chip layout is partitioned into at least first and second channel portions that are electrically interconnected with one another. Each first channel portion has an end that is located on an optical interface side of the multi-channel transmitter or receiver IC chip. Each second channel portion has an end that is located on an electrical interface side of the multi-channel transmitter or receiver IC chip. The pitch between the first channel portions is very fine and matches the pitch between optoelectronic elements of an optoelectronic array chip that interfaces with the optical interface side of the multi-channel transmitter or receiver IC chip. The pitch between the second channel portions is significantly greater than the pitch between the first channel portions to prevent cross talk.