A method for mounting an electronic component (180) onto a component carrier (179) is described. The method comprises (a) optically capturing a first image from a first side of the component (180), at which first side a first structural feature (185) of the component (180) is discernible, by means of a first camera (120), (b) optically capturing a second image from a second side of the component (180), at which second side a second structural feature (186) of the component (180) is discernible, by means of a second camera (160), wherein the first side and the second side are situated opposite one another and wherein the second structural feature (186) is configured to be connected at a predetermined position on the component carrier (175), (c) orienting the electronic component (180) such that a center of the first structural feature (185) is aligned with a desired position relative to the component carrier (175), wherein the second structural feature (186) can be correspondingly offset from the predetermined position, and (d) mounting the electronic component (180) onto the component carrier (175), wherein the center of the first structural feature (185) is aligned relative to the component carrier (175), wherein the second structural feature (186) is offset from the predetermined position. Moreover, a method for checking the functionality of an optoelectronic component in advance of a population of a component carrier and an automatic placement machine for mounting an optically measured electronic component are also described.