Invention Grant
- Patent Title: Pairing terminals with a sound wave signal
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Application No.: US14509160Application Date: 2014-10-08
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Publication No.: US09775184B2Publication Date: 2017-09-26
- Inventor: Jinwoo Lee , Jiyeon Seo , Myunghwan Lee , Yongcheol Cha
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2013-0119573 20131008
- Main IPC: H04W76/02
- IPC: H04W76/02 ; H04W4/00 ; H04W8/00

Abstract:
Disclosed herein are a method and apparatus for pairing terminals using a sound wave. A sound wave is transmitted from a first terminal to a second terminal and a response is sent by the second terminal and detected by the first terminal. The first terminal and the second terminal are paired based at least partially on the sound wave signal and the response signal.
Public/Granted literature
- US20150099470A1 PAIRING TERMINALS WITH A SOUND WAVE SIGNAL Public/Granted day:2015-04-09
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