Invention Grant
- Patent Title: Insulating film, printed circuit board using the same, and method of manufacturing the printed circuit board
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Application No.: US14699808Application Date: 2015-04-29
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Publication No.: US09775253B2Publication Date: 2017-09-26
- Inventor: Dong Hun Kang , Joung Suk Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0096672 20140729
- Main IPC: H05K3/42
- IPC: H05K3/42 ; H05K3/46 ; H05K1/11 ; H05K1/02 ; H05K3/44
Abstract:
There are provided an insulating film, a printed circuit board including the insulating film, and a method of manufacturing the printed circuit board. The insulating film includes a first insulating material; a second insulating material; and a metal thin film disposed between the first insulating material and the second insulating material.
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