The present disclosure is directed, in part, to a method of applying a flowable substance to a substrate. The method comprises contacting a portion of the substrate with a portion of a rotating applicator as the substrate is conveyed, and immersing the portion of the rotating applicator in the flowable substance to accumulate the flowable substance on the portion of the rotating applicator. The method further comprises engaging a metering device with the portion of the rotating applicator, metering a portion of the accumulated flowable substance on the portion of the rotating applicator off of the portion of the rotating applicator using the metering device, and applying a portion of the remaining flowable substance on the portion of the rotating applicator to the portion of the substrate when the portion of the substrate contacts the portion of the rotating applicator.