Invention Grant
- Patent Title: Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials
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Application No.: US14009879Application Date: 2012-03-19
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Publication No.: US09776306B2Publication Date: 2017-10-03
- Inventor: Seh-Kwang Lee , Rak-Joo Sung , Sang-Wook Park
- Applicant: Seh-Kwang Lee , Rak-Joo Sung , Sang-Wook Park
- Applicant Address: KR Osan-Si, Gyeonggi-Do
- Assignee: EHWA DIAMOND INDUSTRIAL CO., LTD.
- Current Assignee: EHWA DIAMOND INDUSTRIAL CO., LTD.
- Current Assignee Address: KR Osan-Si, Gyeonggi-Do
- Agency: Hauptman Ham, LLP
- Priority: KR10-2011-0031177 20110405
- International Application: PCT/KR2012/001943 WO 20120319
- International Announcement: WO2012/138063 WO 20121011
- Main IPC: B24D18/00
- IPC: B24D18/00 ; B23D61/18 ; B23D65/00 ; C25D5/02 ; B25D13/00 ; C25D15/00 ; C25D13/00 ; C25D7/06

Abstract:
The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.
Public/Granted literature
- US20140246005A1 METHOD FOR MANUFACTURING AN ELECTRODEPOSITED DIAMOND WIRE SAW USING PATTERNED NON-CONDUCTIVE MATERIALS Public/Granted day:2014-09-04
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