Invention Grant
- Patent Title: Thermal ink jet printhead
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Application No.: US15111269Application Date: 2014-01-29
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Publication No.: US09776402B2Publication Date: 2017-10-03
- Inventor: Lawrence H. White , Anthony M. Fuller , Huyen Pham
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc.—Patent Department
- International Application: PCT/US2014/013523 WO 20140129
- International Announcement: WO2015/116050 WO 20150806
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/335 ; B41J2/16

Abstract:
The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.
Public/Granted literature
- US20160325547A1 THERMAL INK JET PRINTHEAD Public/Granted day:2016-11-10
Information query
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