Invention Grant
- Patent Title: Overwrap with integral lidding film
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Application No.: US15036677Application Date: 2014-01-21
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Publication No.: US09776782B2Publication Date: 2017-10-03
- Inventor: Keith A. Klipstine
- Applicant: BEMIS COMPANY, INC.
- Applicant Address: US WI Neenah
- Assignee: Bemis Company, Inc.
- Current Assignee: Bemis Company, Inc.
- Current Assignee Address: US WI Neenah
- Agent Amy L. De Coster
- International Application: PCT/US2014/012245 WO 20140121
- International Announcement: WO2015/112110 WO 20150730
- Main IPC: B65D77/00
- IPC: B65D77/00 ; B65D75/58 ; B65D77/20 ; B65D65/40 ; B65D79/00 ; B65D81/34

Abstract:
The present invention relates to improved packages which include a rigid or semi-rigid tray having a single thermoplastic overwrap comprising a polymeric laminate surrounding the tray and having a front panel and an opposing back panel. The inventive packages also include a continuous seal circumscribing a recessed cavity of the tray which comprises a heat seal formed by heat sealing a portion of the front panel to the peripheral flange of the tray. Advantageously, when the tray is removed from the overwrap, a portion of the first film separates from the laminate and remains peelably sealed to the flange of the tray and thus, may serve as a lidding film for the container. Since the recessed cavity is still covered, the container may then be placed directly in a microwave or conventional oven to thaw and/or cook the food container within the package without first removing the lidding film.
Public/Granted literature
- US20160280441A1 OVERWRAP WITH INTEGRAL LIDDING FILM Public/Granted day:2016-09-29
Information query