- Patent Title: Methods of fabricating micro electro mechanical system structures
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Application No.: US14860067Application Date: 2015-09-21
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Publication No.: US09776857B2Publication Date: 2017-10-03
- Inventor: Ting-Ying Chien , Ching-Hou Su , Chyi-Tsong Ni , Yi Hsun Chiu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: B81C1/00
- IPC: B81C1/00
Abstract:
A method of fabricating a micro electro mechanical system (MEMS) structure includes providing a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is provided and bonded with the bonding pad structure of the first substrate structure.
Public/Granted literature
- US20160009550A1 METHODS OF FABRICATING MICRO ELECTRO MECHANICAL SYSTEM STRUCTURES Public/Granted day:2016-01-14
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