Invention Grant
- Patent Title: Silicone-modified epoxy resin and composition and cured article thereof
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Application No.: US15023263Application Date: 2014-09-19
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Publication No.: US09777107B2Publication Date: 2017-10-03
- Inventor: Toshio Shiobara , Junichi Sawada , Miyuki Wakao , Tsutomu Kashiwagi , Naofusa Miyagawa , Yoshihiro Kawada , Chie Sasaki , Masataka Nakanishi , Kenichi Kuboki
- Applicant: Shin-Etsu Chemical Co., Ltd. , Nippon Kayaku Kabushiki Kaisha
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.,Nippon Kayaku Kabushiki Kaisha
- Current Assignee: Shin-Etsu Chemical Co., Ltd.,Nippon Kayaku Kabushiki Kaisha
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Wood, Phillips, Katz, Clark & Mortimer
- Priority: JP2013-196250 20130920
- International Application: PCT/JP2014/074864 WO 20140919
- International Announcement: WO2015/041325 WO 20150326
- Main IPC: C08G59/30
- IPC: C08G59/30

Abstract:
An epoxy resin represented by the following formula (1) wherein R1 represents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; R2 represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R3 represents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R1, R2, R3, k, or m present in the formula may be the same or different from each other.
Public/Granted literature
- US20160237202A1 SILICONE-MODIFIED EPOXY RESIN AND COMPOSITION AND CURED ARTICLE THEREOF Public/Granted day:2016-08-18
Information query
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