Invention Grant
- Patent Title: Polyamic acid, polyimide, polyamic acid solution, polyimide solution, polyimide films obtained from these solutions, and use of polyimide films
-
Application No.: US14125688Application Date: 2012-06-12
-
Publication No.: US09777137B2Publication Date: 2017-10-03
- Inventor: Mari Fujii , Shinji Ozawa
- Applicant: Mari Fujii , Shinji Ozawa
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Kagan Binder, PLLC
- Priority: JP2011-131695 20110613; JP2012-084691 20120403
- International Application: PCT/JP2012/065048 WO 20120612
- International Announcement: WO2012/173126 WO 20121220
- Main IPC: B32B27/32
- IPC: B32B27/32 ; C08K5/20 ; C08G73/10 ; C08G69/26 ; C08K5/1535 ; C09D179/08

Abstract:
Objects of the present invention are: to obtain a polyimide that is excellent in heat resistance, transparency, and optical isotropy and is soluble in an organic solvent; to provide, by using either a polyimide or a polyamic acid which is a precursor or the polyimide, a product or a member that is highly required to have heat resistance and transparency; and particularly to provide a product and a member both of which are obtained by applying a polyamic acid solution and a polyimide solution of the present invention to the surface of an inorganic substance such as glass, metal, metal oxide, or a single crystal silicon. These objects can be attained by a polyimide acid and a polyimide which are each prepared from an alicyclic tetracarboxylic dianhydride and a monomer having a fluorene structure.
Public/Granted literature
Information query