Invention Grant
- Patent Title: Method for manufacturing silicon carbide epitaxial substrate, and silicon carbide epitaxial substrate
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Application No.: US15114017Application Date: 2015-05-21
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Publication No.: US09777404B2Publication Date: 2017-10-03
- Inventor: Keiji Wada , Taro Nishiguchi , Jun Genba
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Laura G. Remus
- Priority: JP2014-230005 20141112
- International Application: PCT/JP2015/064585 WO 20150521
- International Announcement: WO2016/075957 WO 20160519
- Main IPC: D06N7/04
- IPC: D06N7/04 ; C30B29/36 ; C30B25/14 ; C23C16/32 ; C23C16/455 ; C23C16/46 ; C30B25/20 ; H01L21/02

Abstract:
A method for manufacturing a silicon carbide epitaxial substrate includes: a step of placing a silicon carbide single crystal substrate within a chamber and reducing a pressure within the chamber; a step of increasing a temperature within the chamber to a first temperature; a step of introducing hydrogen gas into the chamber and adjusting the pressure within the chamber; a step of introducing hydrocarbon gas into the chamber; a substrate reforming step of increasing the temperature within the chamber to a second temperature and holding the temperature at the second temperature for a predetermined time, with the adjusted pressure within the chamber and a flow rate of the hydrogen gas being maintained and the hydrocarbon gas being introduced; and a step of growing an epitaxial layer on the silicon carbide single crystal substrate by introducing silane gas into the chamber with the second temperature being maintained.
Public/Granted literature
- US20160355949A1 METHOD FOR MANUFACTURING SILICON CARBIDE EPITAXIAL SUBSTRATE, AND SILICON CARBIDE EPITAXIAL SUBSTRATE Public/Granted day:2016-12-08
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