Invention Grant
- Patent Title: Target material thickness measuring apparatus
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Application No.: US14913163Application Date: 2015-07-28
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Publication No.: US09778024B2Publication Date: 2017-10-03
- Inventor: Deyong Wang , Yefa Li , Liang Peng , Congqi Zheng , Daeyoung Choi
- Applicant: BOE Technology Group Co., Ltd. , Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Beijing CN Anhui
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Anhui
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201510061271 20150205
- International Application: PCT/CN2015/085296 WO 20150728
- International Announcement: WO2016/123934 WO 20160811
- Main IPC: G01B11/28
- IPC: G01B11/28 ; G01B11/06 ; G01B5/06 ; G01B5/207

Abstract:
Embodiments of the present invention disclose a target material thickness measuring apparatus including: a support; and a plurality of distance measuring units mounted on the support and arranged in a first direction, the plurality of distance measuring units being configured to respectively measure thicknesses of portions of a target material at a plurality of positions in the first direction. A plurality of thickness values of different portions of the target material along a straight line can be obtained at one time, for example, by performing a single measurement of thicknesses of the portions of the target material at the plurality of positions by means of the plurality of distance measuring units, thereby improving measurement efficiency.
Public/Granted literature
- US20160349037A1 Target Material Thickness Measuring Apparatus Public/Granted day:2016-12-01
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