A microsystem includes a base layer formed from an electrical insulating material. The base layer has an inner surface defining a cavity and an external surface opposed to the inner surface, and in direct communication with an environment. A cap layer and a microelectromechanical (MEMS) device layer are formed from electrical insulating material or an other electrical insulating material. The cap has an inner surface defining a cavity, and an external surface opposed to the inner surface, and in direct communication with the environment. A MEMS device on/in the MEMS device layer is disposed between the base and the cap. Respective adjacent portions of the base, the cap and the device substrate are bonded to define an enclosed space. The enclosed space at least partially includes the base cavity or the cap cavity. At least a portion of a MEMS device on the device layer is in the enclosed space.