Invention Grant
- Patent Title: Heat sink for optical module array assembly
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Application No.: US14705189Application Date: 2015-05-06
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Publication No.: US09778429B2Publication Date: 2017-10-03
- Inventor: Adrian Zagoneanu
- Applicant: ProPhotonix (IRL) LTD
- Applicant Address: IE
- Assignee: ProPhotonix (IRL) LTD
- Current Assignee: ProPhotonix (IRL) LTD
- Current Assignee Address: IE
- Agency: Pandiscio & Pandiscio
- Main IPC: G02B6/00
- IPC: G02B6/00 ; G02B6/42

Abstract:
Apparatus comprising: a heat sink, the heat sink comprising: a body formed out of a heat-transmissive material; at least one channel extending through the body, the at least one channel having an inlet port and an outlet port; at least one opening extending through the body, the at least one opening being configured to receive an optical module therein; at least one securement element mounted to the body for releasably securing an optical module within the at least one opening; and at least one alignment element mounted to the body for ensuring appropriate alignment of an optical module received in the at least one opening.
Public/Granted literature
- US20150323751A1 HEAT SINK FOR OPTICAL MODULE ARRAY ASSEMBLY Public/Granted day:2015-11-12
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