Invention Grant
- Patent Title: Positive resist composition and patterning process
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Application No.: US15147944Application Date: 2016-05-06
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Publication No.: US09778568B2Publication Date: 2017-10-03
- Inventor: Kenji Funatsu , Akihiko Seki
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2015-094749 20150507
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004 ; G03F7/11 ; G03F7/20 ; G03F7/32

Abstract:
A positive resist composition is provided comprising (A) a resin comprising recurring units having adamantane ring and recurring units having cyclopentyl so that the resin may increase its alkali solubility under the action of acid, (B) a mixture of sulfonium salts, and (C) a solvent. By coating the resist composition as a resist film, forming a protective film thereon, and effecting immersion lithography, a pattern of good profile is formed at a high resolution.
Public/Granted literature
- US20160327864A1 POSTITIVE RESIST COMPOSTION AND PATTERNING PROCESS Public/Granted day:2016-11-10
Information query
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