Invention Grant
- Patent Title: High efficiency on-chip 3D transformer structure
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Application No.: US13950557Application Date: 2013-07-25
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Publication No.: US09779869B2Publication Date: 2017-10-03
- Inventor: Robert L. Barry , Robert A. Groves , Venkata Nr. Vanukuru
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Steven Meyers
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F7/06

Abstract:
An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track included first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including third turns of a third radius within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups.
Public/Granted literature
- US20150028986A1 HIGH EFFICIENCY ON-CHIP 3D TRANSFORMER STRUCTURE Public/Granted day:2015-01-29
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