Invention Grant
- Patent Title: Chip package
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Application No.: US14789165Application Date: 2015-07-01
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Publication No.: US09779940B2Publication Date: 2017-10-03
- Inventor: Dror Hurwitz , Alex Huang
- Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Applicant Address: CN Zhuhai
- Assignee: Zhuahai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Current Assignee: Zhuahai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Current Assignee Address: CN Zhuhai
- Agency: Wiggin and Dana LLP
- Agent Gregory S. Rosenblatt; Jonathan D. Hall
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/027 ; H01L23/498 ; H01L21/683 ; H01L21/78 ; H01L23/00 ; H01L21/48 ; H01L23/538 ; H01L23/13 ; H01L23/14 ; H01L23/31 ; H01L23/495 ; H01L23/544
Abstract:
An embedded die package comprising a die having die contract pads in a passivation layer, the die contact pads being coupled to a first side of a feature layer by an adhesive layer, a layer of pillars extending from a second side of the feature layer, the die, feature layer and the layer of pillars being encapsulated by a dielectric material.
Public/Granted literature
- US20170005057A1 CHIP PACKAGE Public/Granted day:2017-01-05
Information query
IPC分类:
