Invention Grant
- Patent Title: Systems and methods for bonding semiconductor elements
-
Application No.: US15456767Application Date: 2017-03-13
-
Publication No.: US09779965B2Publication Date: 2017-10-03
- Inventor: Robert N. Chylak , Dominick A. DeAngelis , Horst Clauberg
- Applicant: Kulicke and Soffa Industries, Inc.
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agency: Stradley Ronon Stevens & Young, LLP
- Main IPC: H01L21/449
- IPC: H01L21/449 ; H01L23/00 ; H01L25/00 ; H01L25/065 ; H01L21/762 ; H01L21/60
Abstract:
A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.
Public/Granted literature
- US20170186627A1 SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS Public/Granted day:2017-06-29
Information query
IPC分类:
