Invention Grant
- Patent Title: Method for evaluating SOI substrate
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Application No.: US15305989Application Date: 2015-02-25
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Publication No.: US09780006B2Publication Date: 2017-10-03
- Inventor: Tsuyoshi Ohtsuki
- Applicant: SHIN-ETSU HANDOTAI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agent Aaron L. Webb
- Priority: JP2014-100758 20140514
- International Application: PCT/JP2015/000943 WO 20150225
- International Announcement: WO2015/173995 WO 20151119
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/66 ; H01L21/02 ; H01L23/66

Abstract:
An SOI substrate evaluating method includes: forming a device onto a measuring SOI substrate, and previously determining a relationship between an interface state density and a leakage power upon application of radio-frequency thereon, or converting the interface state density to a resistance followed by previously determining a relationship between the converted resistance and the leakage power; measuring an interface state density of the evaluation target SOI substrate to determine the interface state density or a resistance converted from the interface state density; evaluating a leakage power of the evaluation target SOI substrate from the measured interface state density of the evaluation target SOI substrate on the basis of the determined relationship between the interface state density and the leakage power, or from a resistance converted from the measured interface state density of the evaluation target SOI substrate on the basis of the determined relationship between the resistance and leakage power.
Public/Granted literature
- US20170047258A1 METHOD FOR EVALUATING SOI SUBSTRATE Public/Granted day:2017-02-16
Information query
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