A semiconductor package includes: a first substrate including a first ground conductor disposed on at least a second surface of a first surface and the second surface; a plurality of electronic elements mounted on the first surface and the second surface of the first substrate; a second substrate adhered to the second surface of the first substrate and including a penetration part formed to accommodate the plurality of electronic elements mounted on the second surface of the first substrate and a second ground conductor connected to the first ground conductor; a molded portion encapsulating the plurality of electronic elements mounted on the first surface of the first substrate; and a shielding layer formed on outer surfaces of the molded portion and the first substrate and at least a portion of a side surface of the second substrate to shield electromagnetic waves.