Invention Grant
- Patent Title: Collars for under-bump metal structures and associated systems and methods
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Application No.: US14853807Application Date: 2015-09-14
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Publication No.: US09780052B2Publication Date: 2017-10-03
- Inventor: Giorgio Mariottini , Sameer Vadhavkar , Wayne Huang , Anilkumar Chandolu , Mark Bossler
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L21/00 ; H01L23/00
Abstract:
The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.
Public/Granted literature
- US20170077052A1 COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS Public/Granted day:2017-03-16
Information query
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