Invention Grant
- Patent Title: Trench to trench fin short mitigation
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Application No.: US15273972Application Date: 2016-09-23
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Publication No.: US09780094B2Publication Date: 2017-10-03
- Inventor: Veeraraghavan S. Basker , Alexander Reznicek
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Matthew C. Zehrer
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/94 ; H01L29/78

Abstract:
A semiconductor structure includes a replacement strap for a finFET fin that provides communication between a storage capacitor and the fin. The storage capacitor is located in a deep trench formed in a substrate and the fin is formed on a surface of the substrate. The replacement strap allows for electrical connection of the fin to the storage capacitor and is in direct physical communication with the fin and the storage capacitor. The replacement strap may be formed by removing a sacrificial strap and merging epitaxially grown material from the fin and epitaxially grown material from the capacitor. The epitaxially grown material grown from the fin grows at a slower rate relative to the epitaxially grown material grown from the capacitor. By removing the sacrificial strap prior to forming the replacement strap, epitaxial overgrowth that may cause shorts between adjacent capacitors is limited.
Public/Granted literature
- US20170012047A1 TRENCH TO TRENCH FIN SHORT MITIGATION Public/Granted day:2017-01-12
Information query
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