Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15208830Application Date: 2016-07-13
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Publication No.: US09780209B1Publication Date: 2017-10-03
- Inventor: Chih-Fen Chen , Bang-Yu Huang , Chui-Ya Peng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/66 ; H01L23/528

Abstract:
A semiconductor device includes a substrate, a gate stack, at least one epitaxy structure, a dielectric material, and a contact. The gate stack is present on the substrate. The gate spacer is present on a sidewall of the gate stack. The epitaxy structure is partially present in the substrate. The dielectric material is present on the substrate and between the epitaxy structure and the gate spacer. The contact is present on the epitaxy structure, the dielectric material, and the gate spacer.
Information query
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