A device for producing a packaged electrode includes: a conveyance unit configured to sequentially overlay the electrode and the pair of separators from a front end side in a conveying direction while conveying the electrode and the pair of separators; a first joining chip configured to join lateral edges of the pair of separators together; at least one second joining chip positioned downstream of the first joining chip in the conveying direction and configured to join the lateral edges of the pair of separators together. Front ends of the lateral edges of the pair of separators being sequentially overlaid while being conveyed by the conveyance unit are joined together by the first joining chip positioned upstream before the front ends are conveyed to the second joining chip positioned downstream.